The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2021

Filed:

Nov. 08, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Ashim Dutta, Menands, NY (US);

Jennifer Church, Troy, NY (US);

Ekmini A. de Silva, Singerlands, NY (US);

Luciana M. Thompson, Albany, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/311 (2006.01); H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 21/321 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76897 (2013.01); H01L 21/31111 (2013.01); H01L 21/3212 (2013.01); H01L 21/76802 (2013.01); H01L 29/66795 (2013.01); H01L 29/785 (2013.01);
Abstract

A method for forming one or more self-aligned contacts on a semiconductor device includes applying a protective layer on an oxide surface above a source and drain of the semiconductor device. The protective layer covers a top surface of the oxide surface selective to nitride above a gate contact pillar. A sacrificial layer is applied to the nitride surface. The sacrificial layer is deposited only on the nitride surface that is selective to the oxide layer coated with the protective layer. The protective layer is removed from the oxide surface and source/drain contact holes are etched in the oxide surface to form self-aligned contacts on the semiconductor device.


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