The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
Apr. 15, 2020
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Masato Negishi, Tokyo, JP;
Kazuo Yoshida, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 43/00 (2006.01); H01L 21/67 (2006.01); B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67132 (2013.01); B32B 43/006 (2013.01); B32B 38/10 (2013.01); Y10S 156/932 (2013.01); Y10S 156/943 (2013.01); Y10T 156/1179 (2015.01); Y10T 156/1983 (2015.01);
Abstract
By using a needle having a flat part on a top surface and concave portions at four corners of the top surface, the semiconductor chip pasted on the adhesive tape is pushed up, and the adhesive tape at four corners of the semiconductor chip are uniformly peeled off. Then, the pickup is performed.