The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
Aug. 23, 2017
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Ken Sakamoto, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/48 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4882 (2013.01); H01L 21/4853 (2013.01); H01L 21/565 (2013.01);
Abstract
A heat sink () having a step in a bottom surface corner and a rectangular planar shape is disposed in an interior of a cavity () of a metal mold () and a first pin () is caused to project from a bottom surface of the cavity () to position the heat sink (). A second pin () projecting from the bottom surface of the cavity () is disposed at the step of the positioned heat sink (). After the heat sink () is positioned, the first pin () is lowered to the bottom surface of the cavity () and the heat sink () is sealed with the mold resin () with the second pin () being left projecting.