IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11062868 B1

PDFFull Text
Date of Patent:
Jul. 13, 2021

Filed:

Dec. 20, 2018

Electromagnetic relay

Applicant:

Fujitsu Component Limited, Tokyo, JP;

Inventors:

Yusuke Uchiyama, Tokyo, JP;

Masahide Mochizuki, Tokyo, JP;

Assignee:

FUJITSU COMPONENT LIMITED, Tokyo, JP;

Attorney:

IPUSA, PLLC

Primary Examiner:

Shawki S Ismail

Assistant Examiner:

Lisa N Homza

Int. Cl.
CPC ...
H01H 7/16 (2006.01); H01H 50/12 (2006.01); H01H 50/14 (2006.01); H01H 50/64 (2006.01); H01H 50/58 (2006.01); H01H 50/56 (2006.01); H01H 50/28 (2006.01); H01R 13/03 (2006.01); H01H 1/10 (2006.01); B32B 15/01 (2006.01);
U.S. Cl.
CPC ...
H01H 50/12 (2013.01); H01H 50/14 (2013.01); H01H 50/28 (2013.01); H01H 50/56 (2013.01); H01H 50/58 (2013.01); H01H 50/648 (2013.01); H01R 13/03 (2013.01); B32B 15/018 (2013.01); H01H 1/10 (2013.01); H01H 2201/024 (2013.01); H01H 2203/004 (2013.01); H01H 2209/002 (2013.01); H01H 2239/072 (2013.01);
Abstract

An electromagnetic relay includes a fixed contact module including a fixed contact, a movable contact module including a movable contact disposed to face the fixed contact, an armature formed of a magnetic material and configured to move the movable contact module to bring the movable contact into and out of contact with the fixed contact, and an electromagnet configured to generate a magnetic field to move the armature. At least one of the fixed contact module and the movable contact module includes a joint at which different components are joined by riveting, and a film with a thermal conductivity higher than, the thermal conductivity of the fixed contact module and the movable contact module is formed on at least one of the fixed contact module and the movable contact module including the joint.

Find Patent Forward Citations

Loading…