The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2021

Filed:

Dec. 05, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Gerald K. Bartley, Rochester, MN (US);

Darryl J. Becker, Rochester, MN (US);

Matthew S. Doyle, Chatfield, MN (US);

Joseph Kuczynski, North Port, FL (US);

Timothy J. Tofil, Rochester, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04L 29/06 (2006.01); G06F 13/40 (2006.01); G06F 21/88 (2013.01); H04L 9/00 (2006.01); G09C 1/00 (2006.01); G06F 21/75 (2013.01); G06F 21/86 (2013.01);
U.S. Cl.
CPC ...
G06F 13/4068 (2013.01); G06F 21/75 (2013.01); G06F 21/86 (2013.01); G06F 21/88 (2013.01); G09C 1/00 (2013.01); H04L 9/002 (2013.01); H04L 63/162 (2013.01);
Abstract

A security matrix layer between a first and second conductive shorting layers are located within a printed circuit board (PCB). The security matrix layer includes at least two types of microcapsules with each type of microcapsule containing a different reactant. When the security matrix layer is accessed, drilled, or otherwise damaged, the microcapsules rupture and the reactants react to form at least an electrically conductive material. The electrically conductive material may contact and short the first and second conductive shorting layers.


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