The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2021

Filed:

Dec. 18, 2018
Applicant:

General Electric Company, Schenectady, NY (US);

Inventors:

Andrew Joseph Detor, Burnt Hills, NY (US);

Pei-Hsin Kuo, Alplaus, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 21/12 (2006.01); G05B 19/408 (2006.01); G06N 20/00 (2019.01); C25D 1/00 (2006.01);
U.S. Cl.
CPC ...
G05B 19/4083 (2013.01); C25D 1/003 (2013.01); C25D 21/12 (2013.01); G06N 20/00 (2019.01); G05B 2219/33034 (2013.01); G05B 2219/49007 (2013.01);
Abstract

A method of forming a component by an electroforming process using an electroforming apparatus is presented. The electroforming apparatus includes an anode, a cathode and an electrolyte including a metal salt. The method includes receiving a set of training electroforming process parameters; training a machine learning algorithm based on at least a subset of the set of training electroforming process parameters; generating a set of updated operating electroforming parameters from the trained machine learning algorithm; and operating the electroforming apparatus based on the set of updated operating electroforming parameters. The step of operating the electroforming apparatus includes applying an electric current between the anode and the cathode in the presence of the electrolyte and depositing a plurality of metal layers on a cathode surface to form the component. A system of forming a component is also presented.


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