The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2021

Filed:

May. 26, 2017
Applicant:

Kes Systems, Inc., Tempe, AZ (US);

Inventors:

Ballson Gopal, Tempe, AZ (US);

Jesse Killion, Atlanta, GA (US);

Assignee:

KES SYSTEMS, INC., Tempe, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G01R 1/04 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2874 (2013.01); G01R 1/0458 (2013.01); G01R 1/0466 (2013.01); G01R 31/2862 (2013.01); G01R 31/2863 (2013.01); G01R 31/2867 (2013.01);
Abstract

Apparatus and methods provide burn-in testing for semiconductors. A burn-in test apparatus () may include an outer housing forming an aperture with a test socket to receive a tile or wafer. The tile or wafer may include semiconductor device(s) for burn-in testing. The apparatus may include a thermal control unit to regulate testing temperature and/or drive electronics for powering the socket. The apparatus may include an inlet for gas pressure from a pressure source. The apparatus may include a lid covering the aperture when a tile/wafer is at the test socket. The apparatus may include a seal carrier in the aperture to form a pressure chamber with a surface of the tile. The pressure chamber may pneumatically couple with the inlet. Pressure of the pressure chamber may act upon the tile/wafer to urge a device under testing into thermal and/or electrical contact with the socket for conducting the burn-in test.


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