The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
Apr. 18, 2016
Hitachi, Ltd., Tokyo, JP;
Tsutomu Kono, Tokyo, JP;
Ryotaro Shimada, Tokyo, JP;
Tsubasa Watanabe, Tokyo, JP;
Hiroki Nakatsuchi, Tokyo, JP;
HITACHI, LTD., Tokyo, JP;
Abstract
Provided is a flow analysis method capable of predicting a flow state of a composite resin material by taking into account a change in filler dispersion degree of the composite resin material. In a flow analysis method for a composite resin material having a filler and a resin, in a certain process of identifying a region in which the composite resin material flows and analyzing a flow, an exothermic reaction speed of the composite resin material in the region is computed using a filler dispersion degree in the composite resin material, a temperature and the filler dispersion degree of the composite resin material in the region is computed using the computed exothermic reaction speed, and an exothermic reaction speed in a process subsequent to a process is computed using the computed filler dispersion degree.