The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2021

Filed:

Apr. 21, 2017
Applicant:

Sensoria, Inc., Redmond, WA (US);

Inventors:

Roberto Reif, Seattle, WA (US);

Maria Pia Carmagnani, Redmond, WA (US);

Warren Kline, Ottawa, CA;

Dave Svab, Woodinville, WA (US);

Maurizio Macagno, Redmond, WA (US);

Chris Small, Seattle, WA (US);

Blake Coudriet, Puyallup, WA (US);

Matthew Kueper, Indianola, WA (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01L 1/00 (2006.01); G01L 1/18 (2006.01); A61B 5/11 (2006.01); A43B 17/00 (2006.01); A61B 5/00 (2006.01); A61B 5/103 (2006.01); A43B 3/00 (2006.01); G01L 1/20 (2006.01); G16H 40/63 (2018.01); G16H 50/20 (2018.01); A43D 1/02 (2006.01); G16H 50/30 (2018.01); A61B 5/024 (2006.01); A61B 5/01 (2006.01); G16H 20/30 (2018.01);
U.S. Cl.
CPC ...
G01L 1/18 (2013.01); A43B 3/0005 (2013.01); A43B 17/00 (2013.01); A61B 5/1038 (2013.01); A61B 5/11 (2013.01); A61B 5/6802 (2013.01); A61B 5/6807 (2013.01); G01L 1/205 (2013.01); G16H 40/63 (2018.01); G16H 50/20 (2018.01); A43D 1/027 (2013.01); A61B 5/002 (2013.01); A61B 5/01 (2013.01); A61B 5/024 (2013.01); A61B 5/1036 (2013.01); A61B 5/447 (2013.01); A61B 5/6831 (2013.01); A61B 2560/0223 (2013.01); A61B 2560/045 (2013.01); A61B 2562/0247 (2013.01); A61B 2562/16 (2013.01); A61B 2562/227 (2013.01); D10B 2401/18 (2013.01); G16H 20/30 (2018.01); G16H 50/30 (2018.01);
Abstract

Components and assemblies for acquisition and analysis of data collected from sites such body surfaces, footwear and apparel, objects, accessories, and the like are directed to providing intermittent and/or continuous monitoring and reporting of conditions such as force, pressure, shear and other conditions, activity and/or environmental parameters at body locations and/or at an interface of a body location and an object. In one aspect, sensor assemblies comprise one or more sensor(s) and/or associated electronics associated with at least one non-conductive carrier layer. Electronic components including sensor acquisition systems (SAS) and dedicated electronics devices (DED) providing electronics components for signal conditioning, data collection, storage, analysis, feedback, communications and optional sensing capabilities are also described.


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