The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
Mar. 02, 2017
Nippon Steel & Sumitomo Metal Corporation, Tokyo, JP;
Vallourec Oil and Gas France, Aulnoye-Aymeries, FR;
Nippon Steel Corporation, Tokyo, JP;
Vallourec Oil and Gas France, Aulnoye-Aymeries, FR;
Abstract
An electroplating apparatus is provided that minimizes unplated regions when an alloy plating layer is provided on the surface of a thread on a steel pipe. An electroplating apparatus () includes an electrode (), sealing members (), and a plating-solution supply unit (). The electrode () faces the thread (Tm). The sealing member () is positioned within the steel pipe (P). The sealing member () is attached to the end portion of the steel pipe (P) and, together with the sealing member (), forms a receiving space (). The plating-solution supply unit () includes a plurality of nozzles (). The nozzles () are positioned within the receiving space () and adjacent one end of the thread (Tm) and arranged around the pipe axis of the steel pipe (P). The plating-solution supply unit () injects a plating solution between the thread (Tm) and electrode () through the nozzles (). The direction in which plating solution is injected from the nozzles () is inclined at an angle larger than 20 degrees and smaller than 90 degrees toward the thread (Tm) relative to a plane perpendicular to the pipe axis.