The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2021

Filed:

Nov. 08, 2019
Applicant:

Purdue Research Foundation, West Lafayette, IN (US);

Inventors:

Jonathan James Wilker, Lafayette, IN (US);

Heather Meredith Chaput, Beavercreek, OH (US);

Assignee:

Purdue Research Foundation, West Lafayette, IN (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09J 133/26 (2006.01); C09J 133/12 (2006.01); C08F 12/24 (2006.01); C09J 133/08 (2006.01); C09J 125/18 (2006.01); C09J 133/10 (2006.01); C08F 120/14 (2006.01); C08F 220/14 (2006.01); C08F 220/28 (2006.01); C08F 220/60 (2006.01); C09J 133/14 (2006.01);
U.S. Cl.
CPC ...
C09J 133/26 (2013.01); C08F 12/24 (2013.01); C08F 120/14 (2013.01); C08F 220/14 (2013.01); C08F 220/28 (2013.01); C08F 220/60 (2013.01); C09J 125/18 (2013.01); C09J 133/08 (2013.01); C09J 133/10 (2013.01); C09J 133/12 (2013.01); C09J 133/14 (2013.01); C08F 220/286 (2020.02); C08F 220/603 (2020.02); C08F 2800/10 (2013.01);
Abstract

Embodiments of this invention relate to adhesives, and more particularly to biomimetic heteropolymer adhesive compositions. Certain embodiments relate to biomimetic terpolymer adhesive compositions including dopamine methacrylamide, 3,4-dihydroxyphenylalanine, or 3,4-dihydroxystyrene, mimicking moieties found in marine mussel adhesive proteins. In some embodiments, elastic moduli of the adhesives are preferably selected to match the elastic moduli of the substrates to minimize stress concentrations, to increase the ductility of the adhesive-substrate system, or both.


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