The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
Jul. 26, 2019
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Yoshihiro Tsutsumi, Annaka, JP;
Naoyuki Kushihara, Annaka, JP;
Norifumi Kawamura, Annaka, JP;
Yoshihira Hamamoto, Annaka, JP;
Yuki Kudo, Annaka, JP;
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 83/08 (2006.01); C08K 3/013 (2018.01); C08G 77/26 (2006.01); H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
C08L 83/08 (2013.01); C08G 77/26 (2013.01); C08K 3/013 (2018.01); C08L 2203/20 (2013.01); H01L 23/296 (2013.01);
Abstract
Provided are a resin composition capable of yielding a cured product exhibiting a superior heat resistance over a long period of time, and a superior reflow resistance due to a low water absorption rate even at a high temperature; and a semiconductor device encapsulated by such cured product. The resin composition is a heat-curable resin composition containing: