The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2021

Filed:

Sep. 24, 2019
Applicants:

Nippon Steel Chemical & Material Co., Ltd., Tokyo, JP;

Mazda Motor Corporation, Aki-gun, JP;

Nippon Graphite Fiber Corporation, Himeji, JP;

Inventors:

Koichi Hattori, Tokyo, JP;

Yutaka Arai, Tokyo, JP;

Masaki Shimada, Tokyo, JP;

Tetsuya Sugiyama, Tokyo, JP;

Katsuya Himuro, Aki-gun, JP;

Masanori Honda, Aki-gun, JP;

Kenji Nishida, Aki-gun, JP;

Hironobu Takahama, Himeji, JP;

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08J 5/24 (2006.01); C08G 59/26 (2006.01); C08G 59/40 (2006.01); C08K 3/04 (2006.01); C08J 5/04 (2006.01); C08K 7/06 (2006.01); C08K 7/14 (2006.01);
U.S. Cl.
CPC ...
C08J 5/24 (2013.01); C08G 59/26 (2013.01); C08G 59/4021 (2013.01); C08J 2363/00 (2013.01); C08J 2433/12 (2013.01); C08K 3/04 (2013.01);
Abstract

To provide prepreg having high thermostability and a molded body (fiber reinforced composite) obtained from the prepreg, the prepreg is formed by impregnating a reinforced fiber having an elastic modulus of 100 to 900 GPa with an epoxy resin composition including the following Components A to D so as to have a resin content within a range of 25 to 50 mass %: Component A: an epoxy resin having an oxazolidone ring structure in a molecule thereof; Component B: an epoxy resin that is liquid at 30° C.; Component C: a diblock copolymer having a B-M structure, wherein M is a block including at least 50 mass % of methyl methacrylate, B is a block immiscible with the epoxy resins and the block M, a glass transition temperature of the block B being 20° C. or lower; and Component D: dicyandiamide, or an amine curing agent that is a derivative of dicyandiamide.


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