The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2021

Filed:

May. 10, 2013
Applicant:

Akron Polymer Systems, Inc., Akron, OH (US);

Inventors:

Limin Sun, Copley, OH (US);

Dong Zhang, Uniontown, OH (US);

Jiaokai Jing, Uniontown, OH (US);

Frank W. Harris, Boca Raton, FL (US);

Zhikuan Lu, Hudson, OH (US);

Xiaoliang Zheng, Hudson, OH (US);

Assignee:

Akron Polymer Systems, Inc., Akron, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 179/08 (2006.01); C03C 17/32 (2006.01); C08G 73/10 (2006.01); G06F 1/16 (2006.01); G02F 1/1333 (2006.01); B32B 17/06 (2006.01);
U.S. Cl.
CPC ...
C03C 17/32 (2013.01); B32B 17/064 (2013.01); C08G 73/1042 (2013.01); C08G 73/1067 (2013.01); C08G 73/1078 (2013.01); C09D 179/08 (2013.01); G02F 1/133305 (2013.01); G06F 1/1652 (2013.01); B32B 2379/08 (2013.01); Y10T 428/265 (2015.01); Y10T 428/31623 (2015.04);
Abstract

A flexible substrate with a high optical transparency (>80% from 400 to 750 nm) that is retained after exposure to 300° C., near-zero birefringence (<±0.001), and a relatively low CTE (<60 ppm/° C.) is disclosed. The substrate may be manufactured as single layer, polyimide films and as a multi-layer laminate comprising a polyimide layer and a thin glass layer. The polyimides may include alicyclic dianhydrides and aromatic, cardo diamines. The films formed of the polyimides can serve as flexible substrates for optical displays and other applications that require their unique combination of properties.


Find Patent Forward Citations

Loading…