The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
May. 30, 2017
Applicant:
Showa Denko Packaging Co., Ltd., Kanagawa, JP;
Inventors:
Kensuke Nagata, Kanagawa, JP;
Tsutomu Ganse, Kanagawa, JP;
Assignee:
SHOWA DENKO PACKAGING CO., LTD., Kanagawa, JP;
Primary Examiner:
Int. Cl.
CPC ...
B32B 43/00 (2006.01); B32B 15/08 (2006.01); H01G 11/78 (2013.01); B23K 26/402 (2014.01); B32B 38/10 (2006.01); B23K 26/00 (2014.01); B23K 26/364 (2014.01); B65D 1/22 (2006.01); B23K 26/53 (2014.01); H01M 50/10 (2021.01); H01M 50/116 (2021.01); H01M 50/124 (2021.01); B23K 26/38 (2014.01); B32B 7/12 (2006.01); B32B 15/085 (2006.01); B32B 15/088 (2006.01); B32B 15/20 (2006.01); H01M 10/058 (2010.01); B23K 103/18 (2006.01); B23K 103/16 (2006.01); B23K 103/12 (2006.01); B23K 103/08 (2006.01); B32B 37/12 (2006.01); B23K 103/10 (2006.01); B23K 103/00 (2006.01); B23K 101/36 (2006.01);
U.S. Cl.
CPC ...
B32B 43/006 (2013.01); B23K 26/0006 (2013.01); B23K 26/364 (2015.10); B23K 26/38 (2013.01); B23K 26/402 (2013.01); B23K 26/53 (2015.10); B32B 7/12 (2013.01); B32B 15/08 (2013.01); B32B 15/085 (2013.01); B32B 15/088 (2013.01); B32B 15/20 (2013.01); B32B 38/10 (2013.01); B32B 43/003 (2013.01); B65D 1/22 (2013.01); H01G 11/78 (2013.01); H01M 10/058 (2013.01); H01M 50/10 (2021.01); H01M 50/116 (2021.01); H01M 50/124 (2021.01); B23K 2101/36 (2018.08); B23K 2103/08 (2018.08); B23K 2103/10 (2018.08); B23K 2103/12 (2018.08); B23K 2103/172 (2018.08); B23K 2103/18 (2018.08); B23K 2103/26 (2018.08); B23K 2103/42 (2018.08); B32B 37/12 (2013.01); B32B 2307/202 (2013.01); B32B 2310/0843 (2013.01); B32B 2311/24 (2013.01); B32B 2323/10 (2013.01); B32B 2377/00 (2013.01); B32B 2435/02 (2013.01); B32B 2439/00 (2013.01); B32B 2439/70 (2013.01); B32B 2439/80 (2013.01); B32B 2457/10 (2013.01); B32B 2553/00 (2013.01);
Abstract
A laminate material with a metal exposed portion is efficiently produced. A peeling step is performed in which a laser beam L is irradiated on a resin layerof a laminate raw materialin which a resin layeris laminated on at least one surface of a metal foilto peel the resin layerand the metal foilto thereby form a peeled portion. Thereafter, the resin layersandcorresponding to the peeled portionsandare cut off to expose the metal foil