The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
Aug. 01, 2018
Applicant:
Corning Incorporated, Corning, NY (US);
Inventor:
Sean Matthew Garner, Elmira, NY (US);
Assignee:
CORNING INCORPORATED, Corning, NY (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 17/10 (2006.01); B32B 17/06 (2006.01); B32B 1/00 (2006.01); B29C 53/00 (2006.01); B32B 37/14 (2006.01); B32B 37/18 (2006.01); B32B 38/00 (2006.01);
U.S. Cl.
CPC ...
B32B 17/10 (2013.01); B29C 53/005 (2013.01); B32B 1/00 (2013.01); B32B 17/064 (2013.01); B32B 37/144 (2013.01); B32B 37/182 (2013.01); B32B 38/0012 (2013.01); B32B 2307/546 (2013.01); B32B 2315/08 (2013.01); B32B 2457/00 (2013.01); B32B 2457/20 (2013.01);
Abstract
A method of forming a flexible glass-polymer laminate structure includes heating a polymer layer to an elevated temperature of greater than 20° C. and below a working temperature of a flexible glass substrate adjacent the polymer layer. The flexible glass substrate has a thickness of no more than about 0.3 mm. The flexible glass substrate is shaped with the polymer layer at the elevated temperature. The polymer layer is cooled below the elevated temperature such that the flexible glass-polymer laminate structure maintains a non-planar formation.