The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2021

Filed:

Oct. 13, 2016
Applicant:

Arkema France, Colombes, FR;

Inventors:

Marc Audenaert, Bernay, FR;

Denis Huze, Fontaine Sous Jouy, FR;

Assignee:

ARKEMA FRANCE, Colombes, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/26 (2006.01); H01B 1/22 (2006.01); B32B 27/34 (2006.01); C08J 5/04 (2006.01); B64D 45/02 (2006.01); C08J 5/24 (2006.01); B32B 5/02 (2006.01); C08K 3/08 (2006.01); C23C 16/06 (2006.01);
U.S. Cl.
CPC ...
B32B 5/26 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 5/026 (2013.01); B32B 27/34 (2013.01); B64D 45/02 (2013.01); C08J 5/042 (2013.01); C08J 5/24 (2013.01); H01B 1/22 (2013.01); B32B 2262/02 (2013.01); B32B 2262/101 (2013.01); B32B 2262/106 (2013.01); B32B 2262/14 (2013.01); B32B 2264/0264 (2013.01); B32B 2307/202 (2013.01); B32B 2307/212 (2013.01); B32B 2419/00 (2013.01); B32B 2605/08 (2013.01); B32B 2605/18 (2013.01); C08J 2377/00 (2013.01); C08K 2003/0806 (2013.01); C23C 16/06 (2013.01);
Abstract

The present invention relates to a method for producing a conductive composite material, as well as the composite material capable of being obtained by said method. The conductive material is obtained from a composite polymer matrix, which is formed by aggregation of composite conductive particles consisting of particles of a polymer matrix, having a diamter d50 of between 1 and 4000 μm, coated with a layer of electrically conductive material consisting of at least one metal. The ratio of the thickness of the conductive layer to the diameter d50 of the polymer matrix particles is between 0.0025:100 and 1.5:100, said thickness being less than 300 nm.


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