The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2021

Filed:

Jul. 19, 2017
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Keiko Kashihara, Osaka, JP;

Takashi Hoshi, Fukushima, JP;

Hiroharu Inoue, Osaka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 5/02 (2006.01); B32B 15/14 (2006.01); C08J 5/24 (2006.01); H05K 1/03 (2006.01); B32B 15/08 (2006.01); B32B 15/092 (2006.01); C08L 63/00 (2006.01); C08K 3/36 (2006.01); C08K 5/5399 (2006.01); C08K 9/06 (2006.01);
U.S. Cl.
CPC ...
B32B 5/024 (2013.01); B32B 15/08 (2013.01); B32B 15/092 (2013.01); B32B 15/14 (2013.01); C08J 5/24 (2013.01); C08L 63/00 (2013.01); H05K 1/03 (2013.01); H05K 1/0366 (2013.01); H05K 1/0373 (2013.01); B32B 2260/021 (2013.01); B32B 2260/046 (2013.01); B32B 2262/0269 (2013.01); B32B 2262/101 (2013.01); B32B 2457/08 (2013.01); C08J 2361/06 (2013.01); C08J 2363/00 (2013.01); C08K 3/36 (2013.01); C08K 5/5399 (2013.01); C08K 9/06 (2013.01); C08K 2201/005 (2013.01); C08K 2201/011 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0257 (2013.01);
Abstract

A prepreg including: a woven cloth substrate; and a semi-cured product of a resin composition. The resin composition contains: at least one of an (A1) component and an (A2) component, a (B) component; a (C1) component; and a (C2) component. The (A1) component is an epoxy resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (A2) component is a phenol resin having at least one of a naphthalene skeleton and a biphenyl skeleton. The (B) component is a high molecular weight polymer. The (C1) component is a first filler obtained by treating surfaces of a first inorganic filler with a first silane coupling agent represented by formula (c1). The (C2) component is a second filler obtained by treating surfaces of a second inorganic filler with a second silane coupling agent represented by formula (c2).


Find Patent Forward Citations

Loading…