The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2021

Filed:

Feb. 17, 2016
Applicants:

The University of Tokyo, Tokyo, JP;

The Foundation for the Promotion of Industrial Science, Tokyo, JP;

Inventors:

Yusuke Kajihara, Tokyo, JP;

Fuminobu Kimura, Tokyo, JP;

Yuta Tamura, Tokyo, JP;

Naotake Nakura, Aichi, JP;

Eiji Yamaguchi, Toyokawa, JP;

Norihito Shibuya, Aichi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/14 (2006.01); B32B 37/15 (2006.01); B32B 3/06 (2006.01); B32B 38/00 (2006.01); B29K 67/00 (2006.01); B29K 679/00 (2006.01); B29K 705/02 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14311 (2013.01); B32B 3/06 (2013.01); B32B 37/153 (2013.01); B29C 2045/14803 (2013.01); B29C 2045/14868 (2013.01); B29K 2067/006 (2013.01); B29K 2679/08 (2013.01); B29K 2705/02 (2013.01); B32B 2038/002 (2013.01);
Abstract

Provided is a method for producing a composite member formed by bonding a base material and a resin member. The method includes: a surface treatment step of forming micro-order or nano-order asperities on a surface of a base material; and a bonding step of directly bonding, by injection molding, a resin member to the surface of the base material that has the asperities formed in the surface treatment step. In addition, the composite member includes: a base material having micro-order or nano-order asperities on a surface thereof; and a resin member that is in direct contact with the surface of the base material.


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