The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
Aug. 19, 2019
Denso Corporation, Kariya, JP;
Nobuhiko Nagai, Kariya, JP;
Koji Tamai, Kariya, JP;
DENSO CORPORATION, Kariya, JP;
Abstract
A die includes a die body, a material supply portion, and a slit portion. The material supply portion includes a material supply surface, and a material supply hole that extends in an extrusion direction from the material supply hole. The slit portion includes an extrusion surface that faces the material supply surface across the material supply hole, and a slit that has a grid shape, opens on the extrusion surface, and communicates with the material supply hole. The slit has a grid point. The material supply hole is provided at a position corresponding to the grid point and coaxially with the grid point. An end of the material supply hole in the extrusion direction includes a throttle hole whose diameter decreases toward the grid point, and a guide hole that extends outward from the throttle hole and guides a material to the slit including the grid point.