The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 13, 2021

Filed:

Nov. 01, 2018
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Matthew S. Kelly, Oakville, CA;

Joseph Kuczynski, North Port, FL (US);

Scott B. King, Rochester, MN (US);

Bruce J. Chamberlin, Vestal, NY (US);

Matthew Doyle, Chatfield, MN (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 3/08 (2006.01); H05K 3/34 (2006.01); B23K 1/00 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
B23K 3/08 (2013.01); B23K 1/0016 (2013.01); H05K 3/3447 (2013.01); B23K 2101/42 (2018.08); H05K 2203/044 (2013.01); H05K 2203/045 (2013.01); H05K 2203/0455 (2013.01); H05K 2203/163 (2013.01);
Abstract

Fabrication of a reliable circuit board assembly with soldered, plated through-hole structures is facilitated by characterizing plating of a plated through-hole of the circuit board using time-domain reflectance to obtain a base reflectance measurement, and applying solder to the plated through-hole. Based on applying the solder, the plating of the plated through-hole of the circuit board is re-characterized using time-domain reflectance to obtain a new reflectance value. Based on a deviation between the new reflectance measurement and the base reflectance measurement exceeding a threshold, dissolution, at least in part, of the plating of the plated through-hole due to applying the solder is identified.


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