The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
Jan. 24, 2018
Siemens Aktiengesellschaft, Munich, DE;
Trevor John Illston, Malvern, GB;
Pratik Yatin Vora, Worcester, GB;
SIEMENS ENERGU GLOBAL GMBH & CO. KG, Munich, DE;
Abstract
A method of additive manufacturing metallic components, the method includes: forming a component in a layer by layer process, the component being formed integrally with at least one non-perforated support structure to be separated from the component after the layer by layer process, the support structure being formed with at least one wall that is non-perforated; and wherein after completion of the layer by layer process, the method includes exposing the component and support structure to at least one thermal pulse so as to weaken, or break, the interface(s) between the support structure and component prior to removal of the support.