The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 13, 2021
Filed:
Feb. 24, 2017
Applicant:
Zeon Corporation, Tokyo, JP;
Inventors:
Masaru Kitagawa, Chiyoda-ku, JP;
Misa Yamamoto, Chiyoda-ku, JP;
Assignee:
ZEON CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A41H 43/00 (2006.01); A41D 19/00 (2006.01); C08F 236/12 (2006.01); C08F 236/10 (2006.01); C08J 3/28 (2006.01); C08K 3/24 (2006.01); A41D 19/04 (2006.01); C08L 13/02 (2006.01); C08K 3/00 (2018.01); C08F 236/06 (2006.01); C08J 3/24 (2006.01); C08K 5/053 (2006.01); C08K 5/098 (2006.01); B29C 35/08 (2006.01); B29C 41/14 (2006.01); B29K 9/06 (2006.01); B29K 105/24 (2006.01); B29L 31/48 (2006.01);
U.S. Cl.
CPC ...
A41H 43/00 (2013.01); A41D 19/0058 (2013.01); A41D 19/04 (2013.01); C08F 236/06 (2013.01); C08F 236/10 (2013.01); C08F 236/12 (2013.01); C08J 3/24 (2013.01); C08J 3/28 (2013.01); C08K 3/00 (2013.01); C08K 3/24 (2013.01); C08K 5/053 (2013.01); C08K 5/098 (2013.01); C08L 13/02 (2013.01); B29C 35/0805 (2013.01); B29C 41/14 (2013.01); B29C 2035/085 (2013.01); B29K 2009/06 (2013.01); B29K 2105/24 (2013.01); B29L 2031/4864 (2013.01); C08F 2810/20 (2013.01); C08K 2201/019 (2013.01);
Abstract
A method for producing a glove, including a step of forming a dip-molded layer by dip-molding a latex composition containing a latex of a carboxyl group-containing conjugated diene rubber (A) and a metal compound (B) including a divalent or higher metal, and is substantially free from sulfur and/or a sulfur-containing compound as a cross-linking agent, and a step of irradiating the dip-molded layer with radiation.