The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2021
Filed:
Jun. 25, 2019
Applicant:
Murata Manufacturing Co., Ltd., Kyoto, JP;
Inventor:
Tomomi Yasuda, Kyoto, JP;
Assignee:
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/11 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/119 (2013.01); H01L 23/13 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 25/18 (2013.01); H05K 1/181 (2013.01); H01L 2224/16235 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/17135 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/1006 (2013.01); H05K 2201/10545 (2013.01);
Abstract
A high-frequency module () includes a substrate (), a first electronic component () and a second electronic component () mounted on a main surface () of the substrate (). The substrate () has a protruding portion () projecting from the main surface (), the first electronic component () is mounted in a region of the main surface () different from a region in which the protruding portion () is provided, and the second electronic component () is mounted on the protruding portion ().