The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2021
Filed:
Nov. 01, 2019
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventor:
Tae Hong Min, Suwon-si, KR;
Assignee:
SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/03 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0393 (2013.01); H05K 1/0298 (2013.01); H05K 1/092 (2013.01); H05K 1/116 (2013.01); H05K 1/028 (2013.01); H05K 1/0281 (2013.01); H05K 1/11 (2013.01); H05K 1/18 (2013.01); H05K 2201/0141 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/2009 (2013.01);
Abstract
A printed circuit board is disclosed. The printed circuit board includes a first substrate portion, and a second substrate portion connected to the first substrate portion and having a flexible insulating layer bendable with respect to the first substrate portion. The second substrate portion includes a block member disposed in the flexible insulating layer and a circuit pattern disposed on a region of the flexible insulating layer, in which the block member is embedded.