The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

Feb. 19, 2020
Applicant:

Denso Ten Limited, Kobe, JP;

Inventors:

Nobuhisa Katada, Kobe, JP;

Kotaro Hosogi, Kobe, JP;

Yasuyuki Watanabe, Kobe, JP;

Toshiyuki Tanaka, Kobe, JP;

Assignee:

DENSO TEN Limited, Kobe, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0206 (2013.01); H05K 1/116 (2013.01); H05K 1/181 (2013.01); H05K 1/184 (2013.01); H05K 2201/0979 (2013.01); H05K 2201/09609 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10022 (2013.01);
Abstract

A printed wiring board according to an embodiment includes a wiring board body, a first connection part and a second connection part. In the first connection part, a heat-receiving front surface is a first land formed on a front surface of the wiring board body. A heat-receiving back surface is formed on a back surface of the wiring board body. A main-heat conducting part is a through-hole that inter-connects the heat-receiving front surface and the heat-receiving back surface. In the second connection part, a second land is formed on the front surface of the wiring board body. The second land is not connected to any conductor pattern formed on the back surface of the wiring board body.


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