The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

Nov. 26, 2018
Applicant:

Finisar Corporation, Sunnyvale, CA (US);

Inventors:

Steven C. Bird, San Jose, CA (US);

Henry Meyer Daghighian, Redwood City, CA (US);

Assignee:

II-VI DELAWARE, INC., Wilmington, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/00 (2006.01); H05K 3/40 (2006.01); H05K 1/18 (2006.01); H01S 5/024 (2006.01); H01S 5/02253 (2021.01); H01S 5/02325 (2021.01); H01S 5/02345 (2021.01); H01S 5/183 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0203 (2013.01); H01S 5/02253 (2021.01); H01S 5/02325 (2021.01); H01S 5/02345 (2021.01); H01S 5/02469 (2013.01); H05K 1/021 (2013.01); H05K 1/0204 (2013.01); H05K 1/181 (2013.01); H05K 3/0026 (2013.01); H05K 3/0044 (2013.01); H05K 3/4007 (2013.01); H01S 5/183 (2013.01); H05K 1/024 (2013.01); H05K 1/028 (2013.01); H05K 2201/09845 (2013.01); H05K 2201/09854 (2013.01); H05K 2201/10121 (2013.01); H05K 2201/10287 (2013.01); H05K 2201/10416 (2013.01); H05K 2203/049 (2013.01);
Abstract

A circuit includes a printed circuit board including a first portion defining a window formed as a first void on a first side of the printed circuit board and a second portion defining a cavity formed as a second void opposite the first void on a second side of the printed circuit board. The circuit further includes a heat sink inserted in the second void, the heat sink having a first side forming a bottom of the first void and the bottom of the first void within the printed circuit board. The circuit yet further includes at least one electronic circuit die mounted to the first side of the heat sink and electrically coupled to the first side of the printed circuit board.


Find Patent Forward Citations

Quick Actions:

Bird, Steven. (2021). High-speed hybrid circuit (U.S. Patent No. 11057984). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11057984

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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