The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

Dec. 09, 2019
Applicant:

Aac Acoustic Technologies (Shenzhen) Co., Ltd., Shenzhen, CN;

Inventors:

Zhenkui Meng, Shenzhen, CN;

Zhengyan Liu, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 19/04 (2006.01); H04R 7/16 (2006.01); H04R 7/12 (2006.01); B81B 3/00 (2006.01);
U.S. Cl.
CPC ...
H04R 19/04 (2013.01); B81B 3/001 (2013.01); B81B 3/0021 (2013.01); H04R 7/12 (2013.01); H04R 7/16 (2013.01); B81B 2201/0257 (2013.01); B81B 2203/0127 (2013.01); H04R 2201/003 (2013.01);
Abstract

A MEMS microphone, includes: a base with a back cavity; and an electric capacitance system arranged on the base. The electric capacitance system includes a back plate, a first diaphragm opposite to and arranged on one side of the back plate, and a second diaphragm arranged on the other side of the back plate. The first diaphragm and the second diaphragm keeps a distance from the back plate for forming a first insulation gap and a second insulation gap respectively. The back plate includes a plurality of through holes; the first diaphragm and the second diaphragm are circular. The MEMS microphone further includes a first support piece between the first diaphragm and the second diaphragm through the through holes. Thus, the two diaphragms are not easy to adhere to the back plate.


Find Patent Forward Citations

Loading…