The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

Oct. 11, 2019
Applicant:

Eaton Intelligent Power Limited, Dubin, IE;

Inventors:

Yakov Lvovich Familiant, Thiensville, WI (US);

Andrew A. Rockhill, Waukesha, WI (US);

Paul J. Rollmann, Menomonee Falls, WI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02B 1/20 (2006.01); H01L 25/07 (2006.01); H02G 5/00 (2006.01); H01L 23/52 (2006.01); H05K 1/02 (2006.01); H05K 7/14 (2006.01); H02M 7/00 (2006.01);
U.S. Cl.
CPC ...
H02B 1/20 (2013.01); H01L 23/52 (2013.01); H01L 25/072 (2013.01); H02G 5/005 (2013.01); H02M 7/003 (2013.01); H05K 1/02 (2013.01); H05K 7/1432 (2013.01); H05K 2201/10272 (2013.01);
Abstract

An apparatus includes a plurality of semiconductor switches. A first bus interconnects first terminals of the semiconductor switches in a first chain and provides a first impedance between the first terminals of switches of the first chain. A second bus interconnects second terminals of the semiconductor switches in a second chain and provides a second impedance greater that the first impedance between the second terminals of the switches of the second chain. The apparatus may be implemented as a laminated bus assembly including respective overlapping conductor plates, wherein the second bus includes a plate having subregions defined by features, such as slots or grooves, that provide the second impedance.


Find Patent Forward Citations

Loading…