The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

Feb. 04, 2019
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo, JP;

Inventors:

Jun Sasaki, Nagaokakyo, JP;

Yoichi Saito, Nagaokakyo, JP;

Takahiro Baba, Nagaokakyo, JP;

Fumie Matsuda, Nagaokakyo, JP;

Yoshitomo Tanaka, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 3/08 (2006.01); H01R 12/71 (2011.01); H05K 3/32 (2006.01); H05K 3/46 (2006.01); H05K 3/28 (2006.01); H05K 1/02 (2006.01); H01P 11/00 (2006.01);
U.S. Cl.
CPC ...
H01R 12/714 (2013.01); H01P 3/085 (2013.01); H01P 3/088 (2013.01); H01P 11/003 (2013.01); H05K 1/02 (2013.01); H05K 3/28 (2013.01); H05K 3/32 (2013.01); H05K 3/46 (2013.01);
Abstract

A module includes a multilayer body that includes insulating-resin base members laminated together, first and second main surfaces, and first and second regions when viewed in plan view. A first conductor pattern and a protective film that covers the first conductor pattern are provided in the first region of the first main surface. Second conductor patterns and holes that extend to the second conductor patterns are provided in the second region of the multilayer body. The holes are provided with conductive joining materials, and connectors are connected to the second conductor patterns by the conductive joining materials.


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