The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

Sep. 27, 2019
Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Daisuke Kasai, Tokushima, JP;

Akira Miki, Anan, JP;

Toru Hashimoto, Tokushima, JP;

Shinichi Daikoku, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/24 (2010.01); G02F 1/13357 (2006.01); H01L 33/50 (2010.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/24 (2013.01); G02F 1/133603 (2013.01); H01L 33/505 (2013.01); H01L 33/62 (2013.01); H01L 2933/0041 (2013.01);
Abstract

In order to obtain a light emitting module with a less unevenness of luminance, provided is a method for manufacturing a light emitting module comprising: preparing a light emitter and a light-transmissive light guide plate, the light emitter comprising a light emitting element, the light guide plate having a first main surface serving as a light emitting surface from which light is emitted outside and a second main surface located opposite to the first main surface and having a concave portion, the concave portion comprising a side surface and a bottom surface that is smaller than an opening of the concave portion in a cross-sectional view; fixing the light emitter to the bottom surface of the concave portion via a bonding member; and forming a wiring at an electrode of the light emitting element.


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