The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2021
Filed:
Jun. 10, 2019
Applicant:
Facebook Technologies, Llc, Menlo Park, CA (US);
Inventors:
William Padraic Henry, Cork, IE;
James Ronald Bonar, Redmond, WA (US);
Gareth Valentine, Redmond, WA (US);
Assignee:
FACEBOOK TECHNOLOGIES, LLC, Menlo Park, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/20 (2010.01); G02B 27/00 (2006.01);
U.S. Cl.
CPC ...
H01L 33/0095 (2013.01); H01L 33/20 (2013.01); G02B 27/0093 (2013.01); H01L 2933/0025 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0058 (2013.01); H01L 2933/0066 (2013.01);
Abstract
Disclosed herein are techniques for wafer-to-wafer bonding for manufacturing light emitting diodes (LEDs). In some embodiments, a method of manufacturing LEDs includes etching a semiconductor material to form a plurality of adjacent mesa shapes. The semiconductor material includes one or more epitaxial layers. The method also includes forming a passivation layer within gaps between the adjacent mesa shapes and bonding a base wafer to a first surface of the semiconductor material.