The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

Jul. 16, 2019
Applicant:

Sensortek Technology Corp., Hsinchu County, TW;

Inventors:

Wen-Chieh Tsou, Hsinchu County, TW;

Yi-Hua Chang, Hsinchu County, TW;

Chih-Wei Chen, Hsinchu County, TW;

Assignee:

SensorTek technology Corp., Hsinchu County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 31/112 (2006.01); G01S 17/08 (2006.01); H01L 31/0203 (2014.01); H01L 33/54 (2010.01);
U.S. Cl.
CPC ...
H01L 31/112 (2013.01); G01S 17/08 (2013.01); H01L 31/0203 (2013.01); H01L 33/54 (2013.01);
Abstract

A complex sensing device packaging structure includes a light emitting element sealed in a first transparent molding material, a light sensing element sealed in a second transparent molding material, a substrate disposed with the light emission element, the light sensing element, the first transparent molding material and the second transparent molding material, and an opaque blocking element disposed on the substrate and between the first transparent molding material and the second transparent molding material, wherein the opaque blocking element is formed by performing a solidifying process to an opaque glue being liquid at the room temperature.


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