The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2021
Filed:
Oct. 11, 2019
Omnivision Technologies, Inc., Santa Clara, CA (US);
Chien-Chan Yeh, Hemei Township, TW;
Ying-Chih Kuo, Hsinchu, TW;
OmniVision Technologies, Inc., Santa Clara, CA (US);
Abstract
A method for fabricating an image-sensor chip-scale package includes bonding, with temporary adhesive, a glass wafer to a device wafer including an array of image sensors. The method also includes forming an isolated-die wafer by removing, from the device wafer, each of a plurality of inter-sensor regions each located between a respective pair of image sensors of the array of image sensors. The isolated-die wafer includes a plurality of image-sensor dies each including a respective image sensor, of the array of image sensors, bonded to the glass wafer. The method also includes encapsulating the isolated-die wafer to form an encapsulated-die wafer; removing, from each of the plurality of image-sensor dies, a respective region of the glass wafer covering the respective image sensor; and singulating the encapsulated-die wafer.