The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

Oct. 27, 2016
Applicant:

Sensl Technologies Ltd, County Cork, IE;

Inventors:

Brian McGarvey, Templemartin, IE;

Stephen John Bellis, Rushbrooke, IE;

John Carlton Jackson, Cobh, IE;

Assignee:

SensL Technologies LTD, County Cork, IE;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/144 (2006.01); H01L 23/48 (2006.01); H01L 27/146 (2006.01); H01L 31/107 (2006.01); H01L 49/02 (2006.01); G01J 1/44 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14643 (2013.01); H01L 23/481 (2013.01); H01L 27/1443 (2013.01); H01L 27/1446 (2013.01); H01L 27/14603 (2013.01); H01L 27/14609 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 28/20 (2013.01); H01L 31/107 (2013.01); G01J 2001/4466 (2013.01);
Abstract

The present disclosure relates to a semiconductor photomultiplier comprising a a substrate; an array of photosensitive elements formed on a first major surface of the substrate; a plurality of primary bus lines interconnecting the photosensitive elements; at least one segmented secondary bus line provided on a second major surface of the substrate which is operably coupled to one or more terminals; and multiple vertical interconnect access (via) extending through the substrate operably coupling the primary bus lines to the at least one segmented secondary bus line.


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