The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

May. 28, 2019
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

James Fred Salzman, Anna, TX (US);

Bradley David Sucher, Murphy, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/092 (2006.01); H01L 27/02 (2006.01); H01L 21/02 (2006.01); H01L 21/8238 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0921 (2013.01); H01L 21/02381 (2013.01); H01L 21/02532 (2013.01); H01L 21/02636 (2013.01); H01L 21/823892 (2013.01); H01L 27/0248 (2013.01); H01L 29/1083 (2013.01);
Abstract

Disclosed examples include semiconductor devices and fabrication methods to fabricate semiconductor wafers and integrated circuits, including forming a first epitaxial semiconductor layer of a first conductivity type on a first side of a semiconductor substrate of the first conductivity type, forming a nitride or oxide protection layer on a top side of the first epitaxial semiconductor layer, forming a second epitaxial semiconductor layer of the first conductivity type on the second side of the semiconductor substrate, and removing the protection layer from the first epitaxial semiconductor layer. The wafer can be used to fabricate an integrated circuit by forming a plurality of transistors at least partially on the first epitaxial semiconductor layer.


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