The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

Dec. 05, 2019
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Colleen F. Mischke, Sunnyvale, CA (US);

Kayo Yanagisawa, Mountain View, CA (US);

Yazan Z. Alnahhas, Mountain View, CA (US);

Assignee:

APPLE INC., Cupertino, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 33/48 (2010.01); H01L 25/16 (2006.01); H01L 33/58 (2010.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 25/167 (2013.01); H01L 33/483 (2013.01); H01L 33/58 (2013.01); H01L 2933/0033 (2013.01);
Abstract

An electronic module includes a circuit substrate including conductive pads interconnected by traces, including a ground pad for connection to an electrical ground. One or more electronic components are mounted on the circuit substrate. A housing including a dielectric material is mounted on the circuit substrate so as to cover the one or more electronic components. A metal lead, which has first and second ends, is embedded in the dielectric material such that the first end contacts the ground pad on the circuit substrate when the housing is mounted on the circuit substrate, and the second end is exposed at an outer surface of the dielectric material. A conductive coating is disposed over the outer surface of the housing in galvanic contact with the exposed second end of the metal lead.


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