The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2021
Filed:
May. 14, 2019
Murata Manufacturing Co., Ltd., Kyoto, JP;
Yuichi Sano, Kyoto, JP;
Atsushi Kurokawa, Kyoto, JP;
MURATA MANUFACTURING CO., LTD., Kyoto, JP;
Abstract
A semiconductor device includes a semiconductor chip mounted to a mounting substrate with an interposer interposed therebetween such that a surface of the semiconductor chip on which bumps are formed faces a surface of the mounting substrate. The mounting substrate has a plurality of metal parts formed as terminals on a surface of the mounting substrate and in contact with electrode pads connected to multilayer wiring. The semiconductor chip has a plurality of functional elements formed in an inner layer and a plurality of bumps formed in contact with element wiring lines of the functional elements such that the bumps protrude from the surface of the semiconductor chip. The interposer has a plurality of first recesses formed in the surface of the interposer facing the surface of the semiconductor chip on which the bumps are formed such that the first recesses accommodate only the bumps.