The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2021
Filed:
Apr. 30, 2019
Applicant:
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Inventors:
Assignee:
SOCLE TECHNOLOGY CORP., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/31 (2006.01); H01L 23/29 (2006.01); H01L 23/52 (2006.01); H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 21/56 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3128 (2013.01); H01L 21/56 (2013.01); H01L 23/293 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 24/09 (2013.01); H01L 24/17 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02381 (2013.01);
Abstract
A chip packaging structure with better reliability includes a first protective layer, a redistribution layer formed on the first protective layer, at least one chip electrically connected to the redistribution layer, and an encapsulating layer covering the redistribution layer, the chip, and the side surfaces of the first protective layer. The first protective layer comprises an exposed surface and at least four side surfaces each connected to the exposed surface. A plurality of second openings is defined in the second protective layer, and a portion of the redistribution layer is exposed from the plurality of second openings.