The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2021
Filed:
Sep. 27, 2018
Applicant:
Furukawa Electric Co., Ltd., Tokyo, JP;
Inventor:
Yusuke Goto, Tokyo, JP;
Assignee:
FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); H01L 21/304 (2006.01); H01L 21/3065 (2006.01); H01L 21/683 (2006.01); B23K 26/361 (2014.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/78 (2013.01); B23K 26/361 (2015.10); H01L 21/02076 (2013.01); H01L 21/304 (2013.01); H01L 21/3065 (2013.01); H01L 21/6836 (2013.01);
Abstract
A surface protective tape, which is used for a method of producing a semiconductor chip including the steps (a) to (d), and contains a substrate film, and a radiation-curable temporary-adhesive layer and a radiation-curable mask material layer provided on the film in this order; wherein, in the step (b), peeling occurs between the temporary-adhesive layer and the mask material layer before irradiation, and between the mask material layer and the patterned surface described below after irradiation: