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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11056376 B1

PDFFull Text
Date of Patent:
Jul. 06, 2021

Filed:

Nov. 05, 2019

Removing an organic sacrificial material from a two-dimensional material

Applicant:

Imec Vzw, Leuven, BE;

Inventors:

Boon Teik Chan, Wilsele, BE;

Jean-Francois de Marneffe, Bossut-Gottechain, BE;

Daniil Marinov, Saint Petersburg, RU;

Han Chung Lin, Heverlee, BE;

Inge Asselberghs, Heverlee, BE;

Assignee:

IMEC VZW, Leuven, BE;

Attorney:

McDonnell Boehnen Hulbert & Berghoff LLP

Primary Examiner:

Vu A Vu

Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/02 (2006.01); H01L 21/78 (2006.01); H01L 29/24 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); H01L 21/02568 (2013.01); H01L 21/7806 (2013.01); H01L 29/24 (2013.01); H01L 29/78696 (2013.01); H01L 2221/68363 (2013.01);
Abstract

In a first aspect, the present disclosure relates to a method for removing an organic sacrificial material from a 2D material, comprising: providing a target substrate having thereon the 2D material and a layer of the organic sacrificial material over the 2D material, infiltrating the organic sacrificial material with a metal or ceramic material, and removing the organic sacrificial material.

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Chan, Boon. (2021). Removing an organic sacrificial material from a two-dimensional material (U.S. Patent No. 11056376). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11056376

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