The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

Jul. 09, 2019
Applicant:

Jx Nippon Mining & Metals Corporation, Tokyo, JP;

Inventor:

Hideki Furusawa, Ibaraki, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 7/00 (2006.01); H01G 4/008 (2006.01); H01G 4/012 (2006.01);
U.S. Cl.
CPC ...
H01G 4/008 (2013.01); H01G 4/012 (2013.01); Y10T 428/12028 (2015.01); Y10T 428/12056 (2015.01);
Abstract

Provided is a laminate of a sintered body produced by sintering a copper powder paste and a ceramic substrate, which has improved adhesion between the sintered body and the ceramic substrate. A laminate with a copper powder paste sintered body laminated on a ceramic layer, the laminate comprising portions where one or more elements selected from Si, Ti and Zr derived from a copper powder surface treatment agent are together present with a thickness in a range of from 5 to 15 nm in boundaries between the copper powder paste sintered body and the ceramic layer, when observing the boundaries by scanning the laminate with STEM over 100 nm across the boundaries in a thickness direction of the laminate.


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