The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

Aug. 24, 2016
Applicant:

Murata Manufacturing Co., Ltd., Kyoto, JP;

Inventors:

Yuki Kanbe, Nagaokakyo, JP;

Masahiro Bando, Nagaokakyo, JP;

Kenta Hino, Nagaokakyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 17/04 (2006.01); H01F 27/28 (2006.01); H01F 27/24 (2006.01); H01F 27/32 (2006.01); H01F 17/00 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2823 (2013.01); H01F 17/045 (2013.01); H01F 27/24 (2013.01); H01F 27/32 (2013.01); H01F 2017/0093 (2013.01);
Abstract

A coil component has a winding core part, and a plurality of wires that are wound on the winding core part to form a plurality of layers. The wires each include a conductor and a covering film that covers the conductor, an outer diameter of the wire of an n-th layer ('n' is an integer that is two or greater) is smaller than an outer diameter of the wire of an (n−1)th layer, an outer diameter of the conductor of the wire of the n-th layer is equal to an outer diameter of the conductor of the wire of the (n−1)th layer, and a thickness of the covering film of the wire of the n-th layer is smaller than a thickness of the covering film of the wire of the (n−1)th layer.


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