The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2021
Filed:
Mar. 13, 2017
Applicant:
Moda-innochips Co., Ltd., Ansan-Si, KR;
Inventors:
In Kil Park, Seongnam-Si, KR;
Seung Hun Cho, Siheung-Si, KR;
Gyeong Tae Kim, Ansan-Si, KR;
Jun Ho Jung, Siheung-Si, KR;
Sang Jun Park, Hwaseong-Si, KR;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01F 27/28 (2006.01); H01F 27/29 (2006.01); H01F 27/32 (2006.01); H01F 41/04 (2006.01); H01L 23/64 (2006.01);
U.S. Cl.
CPC ...
H01F 27/2804 (2013.01); H01F 27/29 (2013.01); H01F 27/323 (2013.01); H01F 41/041 (2013.01); H01L 23/645 (2013.01); H01F 2027/2809 (2013.01);
Abstract
Provided is a coil pattern formed on at least one surface of a substrate and including a first plating film formed on the substrate and a second plating film formed to cover the first plating film, a method of forming the coil pattern, and a chip device provided with the coil pattern.