The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

Oct. 31, 2017
Applicant:

Shenzhen University, Shenzhen, CN;

Inventors:

Changrui Liao, Shenzhen, CN;

Yiping Wang, Shenzhen, CN;

Chupao Lin, Shenzhen, CN;

Yunfang Zhang, Shenzhen, CN;

Assignee:

SHENZHEN UNIVERSITY, Shenzhen, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/125 (2006.01); G02B 6/255 (2006.01); G02B 6/42 (2006.01); G02B 6/02 (2006.01);
U.S. Cl.
CPC ...
G02B 6/125 (2013.01); G02B 6/2551 (2013.01); G02B 6/02385 (2013.01); G02B 6/4293 (2013.01);
Abstract

The present application is applicable to the fiber optics field and provides a hybrid fiber coupler including a lead-in single mode fiber, a coreless fiber, a hollow glass tube and a lead-out single mode fiber fusion-spliced sequentially. Both the lead-in single mode fiber and the lead-out single mode fiber include cores and claddings. Cores of the lead-in single mode fiber and the lead-out single mode fiber are not in the same horizontal direction. A curved waveguide is inscribed inside the coreless fiber and the hollow glass tube and cores of the lead-in single mode fiber and the lead-out single mode fiber are connected with said curved waveguide. The hollow glass tube has a micro-channel at either end thereof, and the two micro-channels form a microfluidic channel with the center of the hollow glass tube for allowing the analytical liquid to access the hollow glass tube. The hybrid waveguide coupler according to embodiments of the present application features cheap manufacturing materials, simple structure and ease of fabrication.


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