The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2021
Filed:
Dec. 30, 2016
Applicant:
Pixart Imaging Inc., Hsin-Chu, TW;
Inventors:
Chih-Ming Sun, Hsin-Chu, TW;
Sen-Huang Huang, Hsin-Chu, TW;
Assignee:
PixArt Imaging Inc., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01J 5/10 (2006.01); G01J 5/12 (2006.01); G01J 1/02 (2006.01); G01J 5/04 (2006.01); G01J 1/42 (2006.01); G01J 5/08 (2006.01); G01J 5/14 (2006.01); G01J 5/00 (2006.01);
U.S. Cl.
CPC ...
G01J 5/12 (2013.01); G01J 1/0271 (2013.01); G01J 1/4228 (2013.01); G01J 5/045 (2013.01); G01J 5/0853 (2013.01); G01J 5/10 (2013.01); G01J 5/14 (2013.01); G01J 2005/0077 (2013.01); G01J 2005/123 (2013.01);
Abstract
A far infrared sensor package includes a package body and a plurality of far infrared sensor array integrated circuits. The plurality of far infrared sensor array integrated circuits are disposed on a same plane and inside the package body. Each of the far infrared sensor array integrated circuits includes a far infrared sensing element array of a same size.