The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

Jul. 25, 2019
Applicant:

City University of Hong Kong, Kowloon, HK;

Inventors:

Binbin Zhou, Kowloon, HK;

Junda Shen, Kowloon, HK;

Yang Yang Li, Kowloon, HK;

Jian Lu, Kowloon, HK;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25F 3/02 (2006.01); C25D 5/34 (2006.01); C25D 3/46 (2006.01); G01N 21/65 (2006.01); C25D 7/06 (2006.01); C25D 5/18 (2006.01);
U.S. Cl.
CPC ...
C25F 3/02 (2013.01); C25D 3/46 (2013.01); C25D 5/18 (2013.01); C25D 5/34 (2013.01); C25D 7/0607 (2013.01); G01N 21/658 (2013.01);
Abstract

A metallic structure and a method for surface treatment of a metallic structure. The method includes the steps of: defining a first surface morphology on a surface of the metallic structure using a first surface treatment process; and manipulating the surface using a second surface treatment process to transform the first surface morphology to a second surface morphology; wherein the metallic structure is substantially made of a first metallic material; and wherein the second surface treatment process includes performing at least one cycle of depositing the first metallic material on the surface of the metallic structure and etching away at least some of the first metallic material from the metallic structure.


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