The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2021
Filed:
Jan. 12, 2017
Applicant:
Advanced Technologies, Inc., Gotenba, JP;
Inventors:
Kinji Hirai, Kawasaki, JP;
Isamu Akiyama, Yokohama, JP;
Tsukasa Takahashi, Gotenba, JP;
Takutaka Sugaya, Gotenba, JP;
Yuka Muto, Gotenba, JP;
Assignee:
ADVANCED TECHNOLOGIES, INC., Gotenba, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/09 (2006.01); C23C 22/05 (2006.01); C23C 22/52 (2006.01); B29C 65/48 (2006.01); B32B 15/20 (2006.01); H05K 3/38 (2006.01); B29C 65/00 (2006.01); B29C 65/02 (2006.01); C23C 26/00 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C23C 22/52 (2013.01); B29C 65/02 (2013.01); B29C 65/48 (2013.01); B29C 66/026 (2013.01); B29C 66/1122 (2013.01); B29C 66/41 (2013.01); B29C 66/71 (2013.01); B29C 66/74281 (2013.01); B29C 66/91935 (2013.01); B32B 15/09 (2013.01); B32B 15/20 (2013.01); C23C 22/05 (2013.01); C23C 26/00 (2013.01); H05K 1/03 (2013.01); H05K 3/389 (2013.01); B29C 66/929 (2013.01); H05K 2203/124 (2013.01);
Abstract
Disclosed is a copper alloy article including: a substratemade of a copper alloy; a polyester-based resin body; and a compound layerfor bonding the substrateand the polyester-based resin body, wherein the compound layercontains; a compound having a nitrogen-containing functional group and a silanol group, and an alkane type amine-based silane coupling agent.