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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11053384 B1

PDFFull Text
Date of Patent:
Jul. 06, 2021

Filed:

Jun. 22, 2017

Curable composition and cured product thereof

Applicant:

Dic Corporation, Tokyo, JP;

Inventors:

Yutaka Satou, Ichihara, JP;

Akito Kawasaki, Ichihara, JP;

Tatsuya Okamoto, Ichihara, JP;

Assignee:

DIC Corporation, Tokyo, JP;

Attorney:

Locke Lord LLP

Primary Examiner:

Robert T Butcher

Int. Cl.
CPC ...
C08L 63/00 (2006.01); H05K 1/03 (2006.01); H01L 23/29 (2006.01); H01L 23/31 (2006.01); C08K 3/36 (2006.01); C08G 59/42 (2006.01); C08G 59/62 (2006.01); C09D 163/00 (2006.01); C08K 5/00 (2006.01); C08K 5/12 (2006.01);
U.S. Cl.
CPC ...
C08L 63/00 (2013.01); C08G 59/4223 (2013.01); C08G 59/621 (2013.01); C08K 3/36 (2013.01); C09D 163/00 (2013.01); H01L 23/29 (2013.01); H01L 23/293 (2013.01); H01L 23/31 (2013.01); H05K 1/03 (2013.01); H05K 1/0326 (2013.01); C08K 5/0025 (2013.01); C08K 5/12 (2013.01);
Abstract

Provided are a curable composition capable of both exhibiting a low shrinkage percentage during curing and forming a cured product having a low elastic modulus under high temperature conditions, a cured product of the curable composition, and a semiconductor encapsulating material and a printed wiring board which are produced using the curable composition. The curable composition includes an active ester compound (A) that is an esterification product of a phenolic compound (a1) and an aromatic polycarboxylic acid or an acid halide thereof (a2); and a curing agent. Also provided are a cured product of the curable composition, and a semiconductor encapsulating material and a printed wiring board which are produced using the curable composition.

Find Patent Forward Citations

Satou, Yutaka. (2021). Curable composition and cured product thereof (U.S. Patent No. 11053384). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11053384

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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