The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 06, 2021

Filed:

Feb. 08, 2018
Applicant:

3m Innovative Properties Company, St. Paul, MN (US);

Inventors:

Ying Lin, Woodbury, MN (US);

Hassan Sahouani, Hastings, MN (US);

Guy D. Joly, Shoreview, MN (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/66 (2006.01); C08K 3/08 (2006.01); C08K 3/26 (2006.01); C08K 3/36 (2006.01); C08G 59/24 (2006.01); C08G 59/68 (2006.01); H01B 3/00 (2006.01); H01B 3/30 (2006.01);
U.S. Cl.
CPC ...
C08G 59/66 (2013.01); C08G 59/245 (2013.01); C08G 59/686 (2013.01); C08K 3/08 (2013.01); C08K 3/26 (2013.01); C08K 3/36 (2013.01); H01B 3/004 (2013.01); H01B 3/307 (2013.01); C08K 2003/085 (2013.01); C08K 2003/0806 (2013.01); C08K 2003/265 (2013.01); C08K 2201/005 (2013.01);
Abstract

The present disclosure provides a curable, one-part epoxy/thiol resin composition. The composition comprises an epoxy/thiol resin mixture including: an epoxy resin component including an epoxy resin having at least two epoxide groups per molecule, a thiol component including a polythiol compound having at least two primary thiol groups, and a nitrogen-containing catalyst for the epoxy resin. The epoxy/thiol resin mixture further includes metal nanoparticles (e.g., silver nanoparticles, copper nanoparticles, or both), dispersed in the epoxy/thiol resin mixture. The present disclosure provides a method of curing a curable, one-part epoxy/thiol resin composition, including providing a curable, one-part epoxy/thiol resin composition and heating the composition to a temperature of at least 50° C.


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